Gyeon Quartz - Q²M Compound+ 強效研磨劑
Q²M Compound+ is a heavy cutting paste that delivers an improved level of scratch removal and high abrasion with a low level of dust and limited secondary defects. Although it does leave light holograms, they are simple to remove with one pass of Q²M Polish.
 
HIGH CUTTING POWER AND GLOSSY FINISH
Q²M Compound+ delivers increased cutting power without the usual price of enormous defects. The formula is water-based and contains high-quality Japanese abrasives that allow fast and easy removal of harsh defects. No silicone or fillers make the procedure of pre-coating preparation and polish removal much faster and easier.
 
CONSUMPTION: 15-40ML/PANEL
 
CUT: ★★★★★★
FINISH: ★★★★
 
Available Capacity: 1000ml
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是一種重切削研磨，可提供更高水平的划痕去除和高耐磨性，同時只有極少的粉塵和有限的二次缺陷。雖然它確實會留下淺色全息圖，但只需通過一次 Q²M Polish 即可輕鬆去除。
 
Q²M Compound+ 提供了更高的切割能力，而沒有通常的巨大缺陷代價。該配方是水基性，含有高品質的日本磨料，可以快速輕鬆地去除粗糙的缺陷。沒有矽樹脂或填料使預塗層準備和拋光去除過程更快更容易。
 
Q²M Compoud+ 不同於任何其他切割拋光劑。以其水基性，速度和溫度都應降低以獲得最佳效果。分小段工作，在表面上緩慢移動機器。提示：Q²M Compound+ 在工作週期的第一階段具有最高的切削能力。每次嘗試不應超過 45 秒。
 
消耗: 15-40ML/面板
 
切削力: ★★★★★★
拋光度: ★★★★
 
產品規格: 1000ml